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![[Laser cut and engrave] Circuit imprimé électronique avec pistes en cuivre](https://storage-public.atomm.com/xtool/community/attachment/xtool-community/399a2f41-b004-4df1-b78f-92268b7c6b1e.jpg?x-oss-process=image/resize,w_1200,h_900,limit_0/interlace,1/format,webp/auto-orient,1)
![[Laser cut and engrave] Circuit imprimé électronique avec pistes en cuivre](https://storage-public.atomm.com/xtool/community/attachment/xtool-community/399a2f41-b004-4df1-b78f-92268b7c6b1e.jpg?x-oss-process=image/resize,w_200,h_150,limit_0/interlace,1/format,webp/auto-orient,1)
![[Laser cut and engrave] Circuit imprimé électronique avec pistes en cuivre](https://storage-public.atomm.com/xtool/community/attachment/xtool-community/52488378-6c11-4e52-9018-a4856d0cfd15.jpg?x-oss-process=image/resize,w_200,h_150,limit_0/interlace,1/format,webp/auto-orient,1)
![[Laser cut and engrave] Circuit imprimé électronique avec pistes en cuivre](https://storage-public.atomm.com/xtool/community/attachment/xtool-community/a704d640-eee9-4fc9-8c04-4e0e11850c81.jpg?x-oss-process=image/resize,w_200,h_150,limit_0/interlace,1/format,webp/auto-orient,1)
PCB

PCB-ESP32
.xs
Application scenario
Laser processing
Machine & module
xTool F2 Ultra UV
5WMaterial used
copper pcb board
166
Information
A simple workflow to create custom PCBs using a laser process.
The design is created in EasyEDA, exported as SVG layers, then prepared in Inkscape before being processed in xTool.
The process includes copper removal, hole cutting, surface cleaning and board outline cutting.
A first prototype showing the possibilities of combining PCB design software with laser fabrication.
Instruction
1
Step1: Design
How I Made the Design
- Designed the PCB in EasyEDA.
- Exported the Copper and Top Silkscreen layers as separate SVG files.
- Grouped and fine-tuned each layer in Inkscape.
- Imported the final SVG files into xTool Studio for laser processing.
2
Step2: Copper Processing

Preview

Preview
Enable layers 2, 5, 6, and 7.
Disable layer 10.
Launch the process.
What happened:
- Copper removal.
- Holes cutting.
- Surface cleaning (see picture).
- Final outline cutting.
3
Step3: Top Layer Processing

Preview
Disable layers 2, 5, 6, and 7.
Enable layer 10.
After flipping the board, take a picture and align layer 10 with the previously cut holes.
Comments
Remixes
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